Introduction

Multilayer chip beads are SMD components that cover a wide impedance characteristic.

Their impedance characteristics mainly comprise resistive components(R), so when an element is inserted in series with a noise conduction passage, the noise content can be attenuated.

Features

1. These small size chips generating high impedance.
2. Either flow or reflow soldering methods can be use due to electroplating of the terminal electrodes.
3. High reliability due to an entirely monolithic structure.
4. Low DC resistance structure of electrode prevents wasteful electric power consumption.

Application

To suppress EMI/ RFI and to prevent self-oscillation in electronic products such as:

• Computers and peripheral equipment.
• VCRS, Television, Pagers.
• Cellular phones.
• Digital communication equipment.
• Various electronics equipments.
• Circuit where a stable ground is unavailable.

A material: Standard type . For signal line application in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 10 to 300MHz.

B material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequency. Designed for high impedance at high frequency for high speed signal line applications.

K material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. lmpedance values selected for effectiveness at 40 to 400MHz.

H material: Designed as a noise countermeasure for the 200MHz~1GHz range where the rise of the Z component is in the high frequency area.

Multilayer Ferrite Chip Bead

High Frequency Ferrite Chip Bead

New Individual Specification